A two component, copper-filled,electrically and thermally conductive epoxy for adhesive bonding in electronics.It may be used at the PCBlevel for inter-connecting,grounding and EMI RF shielding.Fast curing at relatively low temperatures may be realized.
Electrical | |
Electrical, Thermal |
|
Oven | |
2 | |
3 hrs | |
300,000 - 400,000cPs @ 1 rpm |
|
=110°C | |
N/A | |
80°C/30 min 60°C/1 hr |
|
=5 kg | |
1.34 W/mK | |
28 x 10-6 in/in/°C (below Tg) | |
N/A | |
N/A | |
86D | |
N/A | |
Electronics Assembly | |
Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, PCB Level Materials, Semiconductor , Solder Replacement, Wafer Level |
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