FEATURES
• Low viscosity
• Compliant to most international regulations
• Cures to soft, low stress elastomer
• UL V-0 and Mil Spec tested
• IPC-CC-830
• Room temp cure with optional heat acceleration
• UV indicator for inspection
• No added solvents

BENEFITS
• RT cure, no ovens required
• Mild heat acceleration can speed in-line processing
• Low viscosity enhances flow and fill in narrow gaps and spaces
• Good adhesion allows use with many low-solids (no clean) and no-lead solders
• Soft coating can improve reliability against stress
• Can be considered for uses with UL, IPC or Mil Spec requirements

POTENTIAL USES
• Rigid and flexible circuit boards
• Electronic printed wiring boards (PWB)
• Sensitive components and fine pitch designs