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EPO-TEK- H61 Thermal Epoxy

EPO-TEK EPO-TEK H61

EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor,hybrid IC, and electronic circuit assembly applications.

Category:	Thermal
Size:	3 oz Kit
Conductivity:	Thermal
Cure Type:	Oven
Number of Components:	1
Pot Life Value:	25 days
Viscosity Value:	40,000-60,000cPs @ 5 rpm
Tg Value:	=110°C
Thixo Value:	1.32
Recommended Cure:	150°C/30 min 120°C/1 hr
Die Shear Strength:	=20 kg
Thermal Conductivity:	0.70 W/mK
CTE:	17 x 10^-6 in/in/°C (below Tg)
Index Of Refrection:	N/A
Spectral Trans:	N/A
Hardness:	89D
Packaging Options:	N/A
Market:	Electronics Assembly, Hybrid
Application:	Circuit / Electronic Assembly, Glob Top, Heat Sinking, Hybrids Microelectronics, LEDs, Non-Conductive, Packaging Materials, PCB Level Materials, Potting, Semiconductor , Wafer Level