Dow Corning 340 is silicone based thermally conductive compound providing thermal coupling of electrical and electronic devices to heat sinks.White, non-flowing, highly filled compound, good thermal conductivity.
Applications – Compound is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal coupler for many heat sink devices where efficient cooling is required. It is also suitable for aircraft engines where heat sink properties are required.
FEATURES
High thermal conductivity;Low bleed;Stable at high temperatures; Non-flowing; Moderate thermal conductivity
APPLICATION METHODS
Automated or manual dispensing
Composition – Grease-like silicone fluid thickened with metal oxide filler.
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